Capabilities | PCB Fabrication
Cirtronix was founded in 2002 in Bao’an, Shenzhen, as a PCB manufacturing shop serving local and national manufacturing companies. The company built single layer board, double layers board and multi-layers boards. By 2006, had expanded its business to assembly, product design and final assembly. The establishment of our Gushu plant makes us to capable to be an integrated electronic manufacturing service provider. More recently, Cirtronix received certification for our ISO 9001 and ISO 14001 operation, dedicated primarily to consumer, telecommunication and automotive customers. Today, Cirtronix offers customers an unparalleled range of PCB manufacturing and assembly capabilities.
In 2010 Cirtronix Hong Kong established to focus on the Sales and Marketing for overseas business, which also offers value-added purchasing, inventory and logistics services for the customers in need.
In 2013, Cirtronix’s PCB facility has been moved to the new place located in Shajing Bao’an, about 15 kilometers of Shenzhen International Airport. The new facility totals 3600 square-meter, and adds 2 drilling lines and a tooling shop to the Company’s existing capabilities.
Capabilities | Standard |
---|---|
Board types | Multilayer up to 24 layers |
Material | FR4, FR5, FR406, FR408, High-TG(TG>170 ℃),CEM-1, Aluminum and Copper base, Teflon |
Minimum Trace width | 0.1mm |
Minimum Track Width to feature spacing | 0.075mm |
Smallest drilled hole | 0.1mm |
Material Thickness | 0.13mm-6.0mm |
Copper Thickness | Up to 6 oz Cu |
Max board size | 500 mm x 700mm |
Tolerance of dimension | ±0.11mm |
Tolerance of thickness (t ≥0.8mm) | ±8% |
Tolerance of thickness (t ≤0.8mm) | ±10% |
Solder Mask | SMOBC, LPI or Dry Film |
Surface finish | Hot Air Solder Level(HASL) Electroless Nickel / Immersion Silver, ENIG Electroless Tin Lead / Organic ( OSP ) Hard Gold ( edge contact ) / Carbon |
Silkscreen Colors | White, Yellow, Black |
Solder Mask Colors | Green, Blue, Red, Black, Clear |
Bare Board Test | Bed of Nails Simultaneous double-sided flying probe test |
Gold plate | Edge connectors Touch Pads |
Panelization | Routing, V-Groove |